Contents

1   Introduction

This document describes the hardware (HW) components of CUDB nodes running on native BSP 8100.

1.1   Document Purpose and Scope

The purpose of this document is to describe the hardware used for a CUDB node. This information can also be used when ordering a new system, spare parts, or when support is required from HW suppliers.

1.2   Revision Information

Rev. A		This document is based on 3/1551-CSH 109 067/9 with the following change: Removed obsolete hardware information and updated references accordingly. Modifications because of changes in supported hardware type.
Rev. B		Editorial changes only.

1.3   Typographic Conventions

Typographic conventions can be found in the following document:

• Typographic Conventions

2   CUDB Node Hardware Components

The CUDB cabinet layout, the required hardware, and the minimum hardware base configuration for CUDB systems deployed on native BSP 8100 is shown in the "BSP Hardware Installation" document of the BSP 8100 CPI. Refer also to "BSP Hardware Description" for detailed information on the BSP 8100 components.

A CUDB node based on BSP 8100 contains, among others, the following components:

• Two SCXB3 boards per subrack.
• Two CMXB3 boards per subrack.
• Up to 36 GEP3 or GEP5 boards per node.
• Active Patch Panel (APP).

The Ericsson Product Numbers of the switch boards used in CUDB are as follows:

• SCXB3 board, ROJ 208 395/1.
• CMXB3 board, ROJ 208 392/1.

The GEP3 version used in CUDB is the following:

• GEP3-HD300, with 300 GB of storage capacity, ROJ 208 840/3.

The GEP5 versions used in CUDB are as follows:

• GEP5-64-1200 (with 1200 GB storage capacity, ROJ 208 867/5) for System Controllers.
• GEP5-64-400 (with 400 GB storage capacity, ROJ 208 868/5) for all other blades.

The minimum configuration of a CUDB node contains the following components:

• 8 GEP3 blades in the BSP 8100 (GEP3) option.
• 6 GEP5 blades in the BSP 8100 (GEP5) option.

When expanding a node, the minimum scale step is two blades. By default, 10G external uplinks are used for the OAM/PROV network in all BSP 8100 nodes.

The following considerations are applicable only to BSP 8100 (GEP5):

• 1G external uplinks can optionally be used for the OAM/PROV network.
• For CUDB systems deployed on native BSP 8100 (GEP5), when the "BSP Capturing Unit Option" is used, the subrack capacity is decreased by two blades. Refer to the BSP 8100 CPI for more information.

2.1   Active Patch Panel usage in CUDB

The Active Patch Panel (APP) is an Optical/Electrical (O/E) converter used for external connectivity of a CUDB node. It is an out-of-the-box product that does not require any configuration. No alarms are associated to this HW equipment. APP is a mandatory component when a 10GE external uplink is used.

By default, the BSP 8100 comes factory-wired between the CMXB, SCXB, and the APP. As part of the factory wiring, two additional 1GE cables between CMXB 1GE ports (GE2, GE3, and GE4) and APP 1GE ports (A, B, C, and D) can be found. These cables are not used by CUDB since CUDB requires 10GE optical connection to the site switches/routers. In this case, the corresponding GE ports are not configured in CMX.

See Figure 1 for more information about the pre-wired cabling. Refer to Table 1 and Table 2 for details on these additional, unused cables.

Table 1    Pre-wired Cables Connected to CMX-0-26

CMXB Port	APP Port	Cable Type
GE2 and GE3	Upper APP 1GbE A–B	TSR 491 679/1300
GE4	Upper APP 1GbE C–D	TSR 491 678/1000

Table 2    Pre-wired Cables Connected to CMX-0-28

CMXB Port	APP Port	Cable Type
GE2 and GE3	Lower APP 1GbE A–B	TSR 491 679/1300
GE4	Lower APP 1GbE C–D	TSR 491 678/1500

Glossary

For the terms, definitions, acronyms and abbreviations used in this document, refer to CUDB Glossary of Terms and Acronyms, Reference [1].

Reference List

CUDB Documents
[1] CUDB Glossary of Terms and Acronyms.